Semiconductor Chilling Plate Thermosiphon is an advanced two-phase heat transfer solution designed for efficient IGBT cooling in photovoltaic, wind power, and data center applications. Utilizing cutting-edge phase change technology, it transfers heat to a larger heat exchanger for optimal dissipation. Featuring ultra-low power consumption—just 1/10 of traditional systems—it offers energy-efficient cooling with minimal operational costs. The system operates using gravity-driven refrigerants like R134a, R600a, and fluorinated liquids, making it ideal for irregular or confined spaces where reliable thermal management is critical.More
Refrigerant Temperature-40°C to 150°C (-40°F to 302°F)
Burst Pressure≥10MPa
Working MediumR134a\ R600a\ R1234ze and other commonly used refrigerant, Fluorinated liquid.
MountingRivet, Bracket, Reserve holes according to customer needs
CoatingGrey powder, black powder, black electrophoresis, passivation
ApplicationPhotovoltaic, wind power and other IGBT heat dissipation, photovoltaic, wind power, data center and other irregular space heat dissipation, all kinds of chips, semiconductor heat dissipation.
